The PICO Module Family offers an ultra-compact, low-power System-on-Module solution measuring just 37 x 40 mm — the smallest form factor in the TechNexion portfolio. Built with three 70-pin board-to-board Hirose connectors, PICO modules are ideal for space-constrained designs that demand reliable performance, pre-certified wireless connectivity, and modular scalability. Perfect for wearables, smart sensors, portable devices, and compact edge AI systems.
Get all the essential specs in one place.
Our catalog includes detailed mechanical drawings, I/O interfaces, wireless certifications for everything you need to evaluate and integrate PICO modules into your next project.
Ultra-Compact Size
Just 37 x 40 mm — perfect for space-limited designs like wearables, sensors, and handheld devices.
Longevity
15+ years availability from the start of production ensuring the same product to be available during the lifetime of your embedded project.
Scalable and Pin-Compatible
A complete family stretching multiple generations of SOC technology enabling true scalability and futureproof your design.
Sourcecode Software
Yocto Linux, Debian or Android sourcecode can be easily obtained from our github account for seamless development.
Cost-Effective Solutions
Designed with value in mind, delivering reliable performance at a competitive cost without compromising on quality.
Pre-Certified Wi-Fi
Pre-certified wireless options simplify design and reduce costs for end-device certifications.
Power Efficient
Engineered for low power consumption, perfect for battery-operated and energy-sensitive applications where efficiency matters.
Online Technical Help
Provides expert resources and guidance to streamline development and integration.
| Feature | AXON | EDM | PICO |
|---|---|---|---|
| Connector | 4*80-pin Hirose connectors | 260-pin Edge connectors | 70-pin Hirose connectors |
| Size | 58 x 37 mm | 69.6 x 35 mm | 37 x 40 mm |
| Key Advantages | Interface Superset | Low-cost single connector | Smallest size |
| Applications | • Edge Computing • Vehicle vision applications • Drone / UAV / Robotics | • General Embedded • Edge AI / Vision Applications • Smart manufacturing | • Small compact embedded devices • Vibration prone applications • Low-power mobile applications |
Proof of concept within a day. It’s possible with TechNexion’s System on Module Starter kits that bring all bits of hardware to the table. Backed up with demo Yocto, Linux and Debian pre-installed on your evaluation kit and take literally a minute to boot after you receive your kit on your doorstep.
Need a touch display or a camera solution? You can easily add these to the kit and software driver is already made available, assisting you quickly with your proof of concept validation steps.
Integration of Embedded vision camera sensors in your system with TechNexion SOMs is made easy with the TechNexion unified camera driver that comes pre-installed and packaged with your TechNexion System-on-Module.
All TechNexion Embedded Vision products are supported with VizionViewer and VizionSDK, giving your engineering team full control over the camera settings by using C# or Python.
TechNexion offers comprehensive online support with detailed manuals, quick start guides, and FAQs to help you integrate and deploy PICO modules with ease.
Whether you’re at the prototyping or production stage, everything you need is just a click away to streamline your development process.
Yocto, Linux, Debian, or Android source code can be easily accessed through our official GitHub repository, enabling seamless development and integration. With complete BSPs, build instructions, and driver support, developers can customize systems with confidence.
Our open-source approach ensures transparency, flexibility, and faster innovation, whether you’re building embedded applications for industrial, medical, or consumer use.
Building a custom carrier board? TechNexion provides reference schematics and professional design review services to help you reduce hardware risks and ensure compatibility.
Whether you’re a beginner or an experienced developer, we support you in making your design work right the first time.
All PICO modules feature globally pre-certified Wi-Fi and Bluetooth connectivity. This eliminates the need for additional RF certifications, allowing faster time-to-market and reduced costs. Enjoy seamless and reliable wireless performance with minimal engineering effort.
| Part Number | Processor | Memory | Storage | WiFi / Bluetooth | Operating temperature | Family |
|---|---|---|---|---|---|---|
| PICO-IMX93 | NXP i.MX93 | Up to 2GB LPDDR4x | 32GB eMMC | WiFi 4 + BT 5.2 (IW416) | -40°C to +85°C | PICO |
| PICO-IMX8M-MINI | NXP i.MX8M Mini | Up to 8GB LPDDR4 | 16GB eMMC | WiFi 5 + BT 5 | -40°C to +85°C | PICO |
| PICO-IMX8M | NXP i.MX8M Quad | Up to 8GB LPDDR4 | 16GB eMMC | WiFi 5 + BT 5 | -40°C to +85°C | PICO |
| PICO-IMX7 | NXP i.MX7 | Up to 2GB DDR3L | 16GB eMMC SD Card Slot | WiFi 5 + BT 5 | -40°C to +85°C | PICO |
| PICO-IMX6 | NXP i.MX6 Quad NXP i.MX6 Duallite NXP i.MX6 Solo | Up to 1GB DDR3L | 16GB eMMC SD Card Slot | WiFi 5 + BT 5 | -40°C to +85°C | PICO |
| PICO-IMX6ULL | NXP i.MX6UL NXP i.MX6ULL | Up to 1GB DDR3L | 4GB eMMC | WiFi 5 + BT 5 | -40°C to +85°C | PICO |
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