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Processor | NXP i.MX6 UL |
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Processor Speed | 528MHz |
Architecture | ARM Cortex-A7 |
PMIC | NXP PF3000 |
Memory | 256MB DDR3L |
Storage | 4GB eMMC |
Board-to-Board Connector | Edison compatibile connector PICO 70-pin Hirose connectors |
System on Module | PICO SOM |
Network LAN | RMII |
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Wi-Fi | 1x Broadcom BCM4339 802.11 a/b/g/n/ac (optional) |
Bluetooth | 1x Broadcom BCM4339 BT 4.1 (BR+EDR+BLE) (optional) |
Antenna | u.FL connector |
I/O | RGB TTL RMII USB USB OTG I²S CAN UART SPI I²C PWM GPIO |
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Graphic Engine | Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline |
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Audio Codec | On carrier board |
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Audio Interface | I²S (1 channel) |
Power Input | 4.2-5.25V DC |
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Power Consumption | Depending on Configuration |
Standard Support | Linux Yocto |
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Extended Support | Commercial Linux |
Dimensions | 37 x 40 mm / 1⅜ x 1⅝ inch |
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Form Factor | PICO Compute Module |
Weight | 8 grams |
Operation Temperature | Commercial: 0° to +60° C |
Relative Humidity | 10 to 90 % |
MTBF | >100 000 Hours |
Shock | 50G/25ms |
Vibration | 20G/0-600Hz |
Brand | TechNexion |
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Country of Origin | Taiwan |
SKU Number | X103011101002040510511 |
HTSN | 8473.30.1180 |
ECCN | 5A992 |
REACH RoHS | YES |
Single Packing SKU Number | S103011101002040510511 |
Single Unit Packing Quantity | 1 Pcs. |
Single Packing Carton Weight | 100 grams |
Single Packing Carton Dimensions | 141x116x27 mm |
Bulk Packing SKU Number | B103011101002040510511 |
Bulk Packing Quantity | 100 Pcs. |